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Cooling Problem

R

ratmeleon

Weaksauce
Joined
Feb 13, 2004
Messages
119
Hi Guys,

This is kind of unrelated to computers, but the heating issue is something I thought you guys might be able to help out with.

Basically, we have this imaging device, can't say much more because it's something we are developing at work.

But we need to displace about 70W of heat. So we have a Peltier attached to the bottom of a sensor (which generates most of the heat) and then the peltier is connected to the base of a heatsink with heat pipes.

However, we're not able to cool the full 70W that we pump in. And even weirder anomaly is that when we pump in less power, 65W, there is more heat generated.

Any Ideas?

Granted, our heatsink with the heatpipes is oriented upside down. Will that have a major effect? What other problems do you think there might be?

Thanks for your help!

--Rachit
 
Without more details about the setup, I don't know what to say about the "weird anomaly." To increase the amount of heat rejected to the environment you have 3 options.

1. Increase the temperature differential
2. Increase the heat transfer surface area
3. Increase the convective, conductive heat transfer coefficients

1. may not be attainable, it is constrained by the environment.
2. Look into this, see if there are any ways to increase surface area however you might be limited on physical size.
3. This might be your best option. Choice of materials and thermal interfaces can increase the conductive coefficients. Increasing the volumetric flow of air or increasing the turbulence (ie Reynolds number) should help as well.

But if you want some more help a few pictures or a schematic of the apparatus would help a lot. And why is the reason you are using TEC device?
 
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