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DRAM Pricing Jumps 50%, Only 70% of Orders Getting Filled

I believe that as much as I believe pigs can fly. Catapult, trebuchet or cannon notwithstanding.
I like how China went from unable to make DRAM without stealing from Samsung to putting spy chips in their DRAM to spy on Americans. Trust me when I say that Trump wants to 100% sanction China but he can't because US economy would collapse. So instead we just block certain products that make our investors happy.
 
I like how China went from unable to make DRAM without stealing from Samsung to putting spy chips in their DRAM to spy on Americans. Trust me when I say that Trump wants to 100% sanction China but he can't because US economy would collapse. So instead we just block certain products that make our investors happy.
The DoD said that?

This isn't new, btw. If Trump and Biden admins agree, there must be a reason. Probably not spy chips.
The Pentagon designated CXMT a Chinese military ⁠company under the Biden administration, and the Trump administration kept the company on the list in a June update.
CXMT's lawsuit seeks to overturn the designation and remove itself from a Pentagon list that can trigger government contracting restrictions and reputational damage.
"Since its initial designation in January 2025, CXMT has continuously suffered reputational and commercial harm," the company said in a statement to Reuters, adding that it is pursuing the action to protect its business interests.
https://www.reuters.com/world/cxmt-...st-companies-tied-chinas-military-2026-08-29/
 
I like how China went from unable to make DRAM without stealing from Samsung to putting spy chips in their DRAM to spy on Americans. Trust me when I say that Trump wants to 100% sanction China but he can't because US economy would collapse. So instead we just block certain products that make our investors happy.

Take away the (as shown believed by Biden and Trump admins) national security risk etc for a second - you think China is trying to sell you RAM because they love you, and not just to make their own home market investors happy?
 
I believe that as much as I believe pigs can fly. Catapult, trebuchet or cannon notwithstanding.
Like the british boat drones that phone home to china because they used chinese camera chips.. LoL

"British Royal Navy K3 Scout surveillance drones were found transmitting data to an IP address in China due to compromised camera components."
 

"SK hynix CEO Says Memory Shortage Will Last Through 2030

by DrUsmanSaleem Today, 15:45 Discuss (5 Comments)
SK hynix expects the current memory shortage to persist through the end of 2030, with no clear signs of a slowdown yet, according to CEO Kwak Noh-Jung. Speaking after the company's groundbreaking ceremony for its new Indiana packaging facility, Kwak said any eventual slowdown would likely be the result of a gradual easing rather than the sharp price crashes memory markets have previously seen, per Reuters. SK hynix had previously flagged tight supply lasting through 2028 for commodity DRAM, so this latest comment pushes that prediction out further.

Kwak's reasoning is that memory products have moved away from being purely commodity parts. AI-driven demand has pushed customers toward customized DRAM and HBM configurations, which makes future demand easier for manufacturers to forecast and less prone to the abrupt oversupply swings that caused previous crashes."
 

"SK hynix CEO Says Memory Shortage Will Last Through 2030

by DrUsmanSaleem Today, 15:45 Discuss (5 Comments)
SK hynix expects the current memory shortage to persist through the end of 2030, with no clear signs of a slowdown yet, according to CEO Kwak Noh-Jung. Speaking after the company's groundbreaking ceremony for its new Indiana packaging facility, Kwak said any eventual slowdown would likely be the result of a gradual easing rather than the sharp price crashes memory markets have previously seen, per Reuters. SK hynix had previously flagged tight supply lasting through 2028 for commodity DRAM, so this latest comment pushes that prediction out further.

Kwak's reasoning is that memory products have moved away from being purely commodity parts. AI-driven demand has pushed customers toward customized DRAM and HBM configurations, which makes future demand easier for manufacturers to forecast and less prone to the abrupt oversupply swings that caused previous crashes."

"company who's stock value directly benefits from shortage says shortage is going to be a long time"
 
The DoD said that?
Not directly, but he's hinted at it. They call it, “economic D-Day”. Imagine a sanction on China.
This isn't new, btw. If Trump and Biden admins agree, there must be a reason. Probably not spy chips.
If we don't know the reason, and Trump and Biden don't know the reason, then it's to prevent China from enriching themselves. If you want to do that, then push Micron to open more factories. More jobs, more competition, lower prices. To be fair, Trump is investing $10 Billion into Micron but something that may bear fruit in 10 years. It would be smart to make use of CXMT now to boost the US economy.
 

G.Skill Launches Flare X5X Series DDR5 Memory with AMD EXPO-ULL Technology

PRESS RELEASE by btarunr Today, 06:20 Discuss (0 Comments)
G.SKILL International Enterprise Co., Ltd., the world's leading brand of performance overclock memory, announces the launch of the new Flare X5X series DDR5 memory, with initial launch specification of DDR5-6000 CL36-36-36-76 32 GB (2x 16 GB). Continuing G.SKILL's long-standing commitment to memory overclocking technology and high-speed memory, the Flare X5X series DDR5 is designed for users seeking high performance and a clean minimalist hardware aesthetic. Supporting the latest AMD EXPO Technology: Featuring Ultra Low Latency, also known as AMD EXPO ULL, the Flare X5X series overclocking profile leverages fine-tuned memory sub-timings for performance with supported AMD CPU, motherboard, and BIOS.

"AMD EXPO Technology: Featuring Ultra Low Latency" is the newly announced memory overclocking technology released by AMD. Compared to existing G.SKILL DDR5 memory kits that includes AMD EXPO support, the new Flare X5X series come with AMD EXPO ULL that includes multiple extra-tuned memory sub-timing settings in the overclocking profile, which help deliver better latency performance at the same memory speed. PC enthusiasts can experience the enhanced performance by enabling the AMD EXPO ULL memory overclock profile on a system with compatible AMD CPU, motherboard, and supported BIOS version.“
 

G.Skill Launches Flare X5X Series DDR5 Memory with AMD EXPO-ULL Technology

PRESS RELEASE by btarunr Today, 06:20 Discuss (0 Comments)
G.SKILL International Enterprise Co., Ltd., the world's leading brand of performance overclock memory, announces the launch of the new Flare X5X series DDR5 memory, with initial launch specification of DDR5-6000 CL36-36-36-76 32 GB (2x 16 GB). Continuing G.SKILL's long-standing commitment to memory overclocking technology and high-speed memory, the Flare X5X series DDR5 is designed for users seeking high performance and a clean minimalist hardware aesthetic. Supporting the latest AMD EXPO Technology: Featuring Ultra Low Latency, also known as AMD EXPO ULL, the Flare X5X series overclocking profile leverages fine-tuned memory sub-timings for performance with supported AMD CPU, motherboard, and BIOS.

"AMD EXPO Technology: Featuring Ultra Low Latency" is the newly announced memory overclocking technology released by AMD. Compared to existing G.SKILL DDR5 memory kits that includes AMD EXPO support, the new Flare X5X series come with AMD EXPO ULL that includes multiple extra-tuned memory sub-timing settings in the overclocking profile, which help deliver better latency performance at the same memory speed. PC enthusiasts can experience the enhanced performance by enabling the AMD EXPO ULL memory overclock profile on a system with compatible AMD CPU, motherboard, and supported BIOS version.“

I don't really care what new model RAM any company releases as we all know price is going to be stupid ridiculous. Until prices are reigned in to late 2024 prices RAM companies will not get my money.
 

CXMT Starts Risk Production of HBM3E Memory

by AleksandarK Today, 08:30 Discuss (4 Comments)
Chinese memory giant CXMT has reportedly begun risk production of HBM3E memory, according to The Information. This indicates that Chinese memory manufacturers are currently two generations behind South Korean companies, which are gradually transitioning to HBM4E memory production. However, this is a significant milestone for CXMT, which is on track to achieve a manufacturing capacity of around 350,000 DRAM wafers per month by the end of the year, with plans to increase that capacity in the coming years. It is reported that HBM3E manufacturing has started in very low quantities, signifying the commencement of risk production.

While we don't know the specifications of CXMT's HBM3E memory, we know that the standard JEDEC specification states that this must be a 1,024-bit width, and speeds of anywhere from 9.2 Gbps per pin to 12.4 Gbps, with most of the standard configurations targeting 9.6 Gbps per pin. The total bandwidth is around 1.2 TB/s, and capacities come in anywhere from 24 GB using 8-hi stacks or 36 GB using 12-high stacks of 24 Gb layers. However, given that CXMT progresses rapidly from risk production to mass production, we could see high volume manufacturing take place in just a few weeks.“
 

“Samsung Locks 70% of Memory Capacity Into 2031 Deals – Long-Term HBM Deals Run 5x Cheaper Than Spot, as AI Demand Chokes the DRAM Market​


The growing demand for high bandwidth memory (HBM) from the AI buildout has led to Samsung having booked 70% of its memory production capacity for long-term agreements (LTAs), according to a new report from the Korean media. These agreements are providing Samsung's customers with significant price reductions compared to the HBM spot price, which is as much as five times higher than that of the LTAs.

Samsung's Primary LTA Contract Partners Are Big Tech Players Such As Microsoft, Google & NVIDIA, Says Report​

According to a report in the SEDaily, the high demand for HBM has led to tightness in the DRAM market. An HBM module is assembled out of several DRAM modules packed together, and the report outlines that as manufacturers shift towards HBM4 memory, the DRAM market is facing additional shortages. Newer generations of HBM, such as HBM4, use more DRAM layers per module than older generations, leading to an impact on overall DRAM output available for non-HBM use cases.”

Source: https://wccftech.com/samsung-locks-...han-spot-as-ai-demand-chokes-the-dram-market/
 
ChangXin Memory Technologies (CXMT) released its first-half 2026 earnings report today. Seems very good. Hope there is a good competition against the big three from this point onwards. Whether CXMT can help to drive the DRAM prices down in US depends on our regulators. Give enough time and the quality of the DRAM chips coming out, CXMT may start putting pressure on memory prices or will they behave like the big three?. Will see.

Earnings Highlights:
Revenue:
Reached 150.3 billion yuan ($22.36 billion), a jump of roughly 874% compared to the previous year.
Net Profit: Swung to a profit of 77.6 billion yuan ($11.55 billion), up from a net loss of 2.3 billion yuan the prior year.
Market Driver: Strong global demand for AI computing power and DRAM memory shortages

Copied from Barron's online (paywall)
Memory-chip maker CXMT is China's largest company by total market capitalization. PHOTO: CN-STR/AFP via Getty Images
ChangXin Memory Technologies has ridden the artificial-intelligence boom to become China's most valuable company—and soaring revenue may help power shares even higher next week.
The memory-chip maker filed its first earnings report since going public in July on Friday. For the first half of 2026, it posted net income of 117.1 billion yuan ($17.4 billion), as revenue soared 150.3 billion yuan.
Both figures were up sharply as chip demand soars. For the last fiscal year, CXMT reported a net loss of 2.3 billion yuan and revenue of 15.4 billion yuan.
The results could extend CXMT's stellar start to life as a public company. Shares surged 466% on their trading debut in Shanghai a month ago and have continued to rack up gains since then.
As of Friday's close, the company had a total market capitalization of 3.28 trillion yuan—making it China's largest, ahead of the likes of videogame giant Tencent and online retailer Alibaba.
The surge in revenue comes amid a surge in demand for high-speed memory chips, which are needed to process data for AI. Rivals Micron, SK Hynix, and Samsung have also racked up significant gains over the past year.
Write to George Glover at george.glover@dowjones.com
By George Glover

Copyright 2026 Dow Jones & Company, Inc. All Rights Reserved.
Much of their capacity may be eaten up by China's AI endeavors.
 
I don't really care what new model RAM any company releases as we all know price is going to be stupid ridiculous. Until prices are reigned in to late 2024 prices RAM companies will not get my money.

"Samsung New Memory Roadmap: HBM5 Aims for 2x Performance, zHBM for 8x

by Nomad76 Today, 15:09 Discuss (1 Comment)
Samsung presented its updated memory roadmap at SEMICON Taiwan 2026, with HBM5 and the upcoming zHBM architecture being the main focus points while setting ambitious goals and expectations. According to Samsung, HBM5 is targeting twice the performance and 20% higher performance per watt compared to HBM4E, alongside a 20% reduction in thermal resistance. As changes, the base die moves from the 4 nm process used in HBM4 and HBM4E to Samsung's in-house 2 nm node, and the stack options expand to 12, 16, and 20 layers. Mass production is expected around 2028. Recently, Samsung confirmed at the Hot Chips 2026 conference's Advance Program that the company is preparing to ship HBM4E memory with speeds of 16 Gbps per pin. Samsung is currently shipping HBM4 that works at 11.7 Gbps per pin.

zHBM uses a more radical approach, rather than placing memory beside the accelerator as conventional HBM does, zHBM stacks memory directly on top of the processor, shortening the data path and delivering higher bandwidth and efficiency. With zHBM, Samsung is targeting eight times the raw performance and three times the performance per watt of HBM4E, with thermal resistance reduced by 75-90%. At FMS 2026, Samsung unveiled the industry's first concept models of zHBM and is expected to launch this completely different architecture after 2029. Rethinking the HBM architecture appears to be the direction the industry is heading. NVIDIA recently announced its own NVHBM custom memory that moves the memory controller into the HBM base die rather than keeping it on the compute die."
 

"Samsung New Memory Roadmap: HBM5 Aims for 2x Performance, zHBM for 8x

by Nomad76 Today, 15:09 Discuss (1 Comment)
Samsung presented its updated memory roadmap at SEMICON Taiwan 2026, with HBM5 and the upcoming zHBM architecture being the main focus points while setting ambitious goals and expectations. According to Samsung, HBM5 is targeting twice the performance and 20% higher performance per watt compared to HBM4E, alongside a 20% reduction in thermal resistance. As changes, the base die moves from the 4 nm process used in HBM4 and HBM4E to Samsung's in-house 2 nm node, and the stack options expand to 12, 16, and 20 layers. Mass production is expected around 2028. Recently, Samsung confirmed at the Hot Chips 2026 conference's Advance Program that the company is preparing to ship HBM4E memory with speeds of 16 Gbps per pin. Samsung is currently shipping HBM4 that works at 11.7 Gbps per pin.

zHBM uses a more radical approach, rather than placing memory beside the accelerator as conventional HBM does, zHBM stacks memory directly on top of the processor, shortening the data path and delivering higher bandwidth and efficiency. With zHBM, Samsung is targeting eight times the raw performance and three times the performance per watt of HBM4E, with thermal resistance reduced by 75-90%. At FMS 2026, Samsung unveiled the industry's first concept models of zHBM and is expected to launch this completely different architecture after 2029. Rethinking the HBM architecture appears to be the direction the industry is heading. NVIDIA recently announced its own NVHBM custom memory that moves the memory controller into the HBM base die rather than keeping it on the compute die."

And? Will the end user enthusiast see this performance? No because it is for AI data servers. We won't see jack diddly squat except for ever increasing DDR prices.

I think the technology is cool but it currently is of zero use to end users.
 
And? Will the end user enthusiast see this performance? No because it is for AI data servers. We won't see jack diddly squat except for ever increasing DDR prices.

I think the technology is cool but it currently is of zero use to end users.
☹️
 
"Aug 31 (Reuters) - Chinese memory chipmaker CXMT (688825.SS), opens new tab has begun producing advanced high-bandwidth memory in small ‌quantities, the Information reported on Monday.
Make sense of global markets with the Trading Day newsletter. Sign up here.

  • CXMT is making HBM3E, an advanced type of high-bandwidth memory that is used in ⁠AI chipsets, the report said, citing two people familiar with the matter.
  • The company plans to expand production in 2027, according to the report.
  • Several Chinese chip designers, including Alibaba Group’s ‌T-Head ⁠and Beijing-based Cambricon Technologies, are testing the memory with their processors, the report said.
  • These companies will use ⁠CXMT’s memory in products as early as next year if all goes ⁠to plan, the report said.
  • CXMT, Cambricon and Alibaba’s T-Head ⁠were not immediately available for comment."

https://www.reuters.com/world/asia-...-memory-chips-information-reports-2026-08-31/
 

"Chinese memory maker YMTC wants to dethrone Samsung and SK hynix by the end of 2027​


YMTC has some big plans.


With the memory crisis in full swing, it's taking severe chunks out of the supplies of both NAND (used for SSD storage) and DRAM, which is used for RAM modules. Chinese memory maker YMTC has had a lucrative couple of years with the former, yet it's not done yet. YMTC reportedly wants to sit at the very top of the pile for NAND flash memory, and it wants to do it very soon.

According to the Financial Times, citing "two people with knowledge of the matter", YMTC told investors that it wants to be the leader in the market (ahead of Samsung and SK hynix) by the end of 2027. That's a pretty bold claim considering it would need to more than double its current market share.
According to Counterpoint Research, YMTC holds a 13% market share, while NAND memory leader Samsung holds 29%. In fairness, though, YMTC does appear to be building up its infrastructure to handle growth."

https://www.pcgamer.com/hardware/ss...rone-samsung-and-sk-hynix-by-the-end-of-2027/
 

“DDR4 now costs 8.6× more than it did 10 years ago
https://www.notebookcheck.net/filea...nc5/Samsung-Electronics-ddr4-memory-chips.jpg
Samsung DDR4 memory chips. Prices for older memory have surged to record highs.​

DDR4 memory prices have hit record highs as the AI boom puts increasing pressure on global memory supplies. The average price of an 8Gb DDR4 chip has now reached $25 — 8.6 times higher than a decade ago.
Andrew Sozinov, Published 09/02/2026 🇩🇪
Business

High-bandwidth memory (HBM), widely used in artificial intelligence accelerators, continues to consume manufacturers’ limited production capacity, pushing up prices for conventional PC memory. Even weak demand for laptops and other consumer devices has failed to ease the pressure on the market.
According to TrendForce, the average contract price for a standard 8Gb DDR4 DRAM chip rose 4.17 % in August to $25. That is a new record and about 8.6 times higher than in June 2016, when TrendForce began tracking the market.
DDR4 prices have been rising for most of the past year. They climbed for 11 consecutive months from April 2025 through February 2026, before resuming their growth in April. DDR4 has also become more expensive than newer DDR5 in some cases, creating an unusual price inversion between the two generations.
For a while, DDR4 served as a sort of lifeline for the PC market …”

https://www.notebookcheck.net/DDR4-now-costs-8-6x-more-than-it-did-10-years-ago.1385698.0.html
 

Micron Explores Near-GPU NAND Flash to Run Bigger LLMs

by AleksandarK Today, 05:19 Discuss (0 Comments)
Micron is reportedly exploring the idea of developing high-endurance NAND Flash modules that would be positioned closer to the GPU, rather than being located far away in the storage pool behind multiple protocols. The company is said to be investigating ways to bring NAND Flash closer to handle workloads that don't require the latency and bandwidth of traditional HBM or regular DRAM modules. This architecture, currently referred to as "near-GPU NAND," would serve as a middle ground between density and durability. This concept would allow GPUs to access a pool of NAND Flash that has a lower density than conventional TLC or QLC NAND, but instead focuses on improving I/O speeds, bandwidth, and read times.

For instance, this would enable a GPU to access a potential storage pool with hundreds of gigabytes of storage directly on the GPU package or PCB, similar to what DRAM like HBM or GDDR7/LPDDR6 already does. This tier would sit between GPU memory and regular system storage, acting as a very fast buffer, which would be ideal for the inference of massive LLMs. At that point, LLMs wouldn't be memory-bound and could run on systems with fewer GPUs, but with more storage and memory tiers to compensate for the required inference size. Additionally, this NAND would be significantly cheaper than HBM or regular DRAM and would be sized according to system specifications. Images below are HBF slides from SK hynix and Sandisk.“
 
With the memory crisis in full swing, it's taking severe chunks out of the supplies of both NAND (used for SSD storage) and DRAM, which is used for RAM modules. Chinese memory maker YMTC has had a lucrative couple of years with the former, yet it's not done yet. YMTC reportedly wants to sit at the very top of the pile for NAND flash memory, and it wants to do it very soon.

According to the Financial Times, citing "two people with knowledge of the matter", YMTC told investors that it wants to be the leader in the market (ahead of Samsung and SK hynix) by the end of 2027. That's a pretty bold claim considering it would need to more than double its current market share.
According to Counterpoint Research, YMTC holds a 13% market share, while NAND memory leader Samsung holds 29%. In fairness, though, YMTC does appear to be building up its infrastructure to handle growth."

They could do it and I wouldn't put it past them to pull it off. I fully get that China is backing their every step and that's why they can expand wildly and invest so much. But, on this side of the pond, and in Europe, companies have become far too corrupt about government support. A lot of the time they just take the loan guarantees and "contracts" and use it to boost shareholder returns instead of actually accomplishing what the actual build out of infrastructure. Look at all the tax breaks and funds for the entire internet rollout and how often they just miss their targets or say they refuse to go any further despite taking the money to roll out more fibre. Same goes for so many companies when they're given tax breaks to create jobs and then the jobs never materialize, or there are far less of them than promised. The various levels of government should be taking a far harsher stance on this sort of stuff and then maybe the western world could actually get value for its tax dollars but the politicians are too far in bed with the companies lining their pockets so the tax dollars just end up funneling into profits, not infrastructure.
 
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